The first event from Cambridge Wireless's new Semiconductor Special Interest Group, running 13:30 to 17:30. It examines the developing chiplet ecosystem: heterogeneous integration, packaging, thermal management, interconnects and photonics integration, and where UK design and research strengths might contribute to next-generation semiconductor products. The venue is listed differently across secondary sources, so confirm it with the organiser.
Who it is for
Semiconductor design, packaging and systems engineers in the Cambridge cluster and beyond.