Company profile
Hybrid Integration
Torbay advanced-packaging engineering firm providing die attach, flip-chip and optical and photonic packaging design, assembly coordination, failure analysis and validation services to semiconductor, photonics and quantum customers.
Company overview
Hybrid Integration is a UK-based technical partner specialising in advanced packaging for microelectronic and photonic applications. Located at the Electronics & Photonics Innovation Centre (EPIC) in Paignton, the company assists clients with packaging challenges through several service models. It provides complete technical project delivery, managing the process from initial scope to final assembly. For clients with existing plans, it offers targeted support including custom builds, design input, and testing services. Additionally, Hybrid Integration conducts failure analysis, using its in-house laboratory and partner network to investigate issues, identify root causes, and provide solutions. The firm states it has over 40 years of combined industry experience and focuses on delivering predictable and reliable packaging outcomes.
Semiconductor activity
Primary capability: Advanced Packaging. Supply-chain role: Design, Test, Packaging.
Technologies and capabilities
- Advanced Packaging
- Inspection / Failure Analysis
- Microelectronic Packaging
- Photonic Packaging
- Failure Analysis
Technical Project Management; Packaging Design Support; Custom Assemblies; Testing Support; Failure Analysis
Markets served
- Microelectronics
- Photonics
UK presence
Paignton.