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Company profile

ICEMOS Technology

Belfast company providing silicon wafer processing and foundry services, including deep reactive-ion etching, MEMS structures and specialist substrate products.

Company overview

IceMOS Technology is a semiconductor company with manufacturing operations in Belfast, Northern Ireland, as part of a US-based private company headquartered in Tempe, Arizona. Established in 2004, the firm specialises in Superjunction MOSFETs, MEMS solutions, and advanced engineered substrates. Its core technical expertise includes wafer bonding, Deep Reactive Ion Etch (DRIE), and wafer shaping. The company manufactures a range of products on 100mm to 200mm wafers, including Silicon-on-Insulator (SOI) and directly bonded Silicon-Silicon (SiSi) wafers. It also provides foundry services such as trench etching and refilling. Its substrates and devices are supplied to various sectors, including the automotive, IT hardware, telecommunications, power supply, and medical industries.

Semiconductor activity

Primary capability: Foundry / Wafer Fabrication. Supply-chain role: Device Manufacturer, Foundry, Materials Supplier.

Technologies and capabilities

  • Silicon
  • MEMS
  • Superjunction MOSFET
  • Wafer Bonding
  • Deep Reactive Ion Etch (DRIE)
  • Silicon-On-Insulator (SOI)
  • Through-Silicon Via (TSV)
  • Bonded Silicon (SiSi)

Superjunction MOSFETs; Engineered Substrates; Foundry Services; MEMS Solutions; Custom Substrates; Wafer Bonding

Markets served

  • Automotive
  • IT Hardware
  • Power Supplies
  • Renewable Energy
  • Telecommunications
  • Medical Devices

UK presence

Belfast. Part of the Northern Ireland cluster.

Funding and transactions

The company has received venture capital funding, including a $22 million Series E investment round.

Sources and verification