Company profile
ICT Ltd
Shepperton precision micro-manufacturing company offering wafer dicing, thinning and back-grinding, die bonding, chip-on-board assembly, thin-film deposition and dimensional metrology for photonics, quantum and semiconductor customers.
Company overview
Informatic Component Technology Ltd (ICT) is a precision engineering company based in Shepperton, UK, providing micro-component manufacturing and assembly services for high-technology sectors. Founded in 1991 with roots in the magnetic recording head industry, the company has expanded its capabilities to serve a broader market. Its services support the product development lifecycle, from early-stage research and prototyping to low-volume production. Key in-house processes include wafer processing and dicing, wire and die bonding, thin film deposition, micro laser welding, and precision lapping. ICT works with customers ranging from start-ups and research institutions to established manufacturers in end markets such as photonics, quantum technologies, medical electronics, and semiconductor packaging. The company operates from its UK manufacturing facility at Shepperton Studios.
Semiconductor activity
Primary capability: Back-End Assembly / Packaging. Supply-chain role: Manufacturing Services, Assembly Services, Prototyping, Product Development.
Technologies and capabilities
- Wafer Processing
- Advanced Packaging
- Wafer Dicing
- Wire Bonding
- Die Bonding
- Thin Film Deposition
- Micro Laser Welding
- Precision Lapping
Micro Component Manufacturing; Micro Assembly; Metrology & Inspection; Inkjet Printhead Components; Magnetic Recording Heads; Wafer Processing
Markets served
- Photonics
- Quantum Technologies
- Medical Electronics
- Semiconductor Packaging
- Industrial Inkjet
- Aerospace
UK presence
Shepperton.