Company profile
RAM Innovations
Develops and manufactures embedded-die semiconductor packaging and power modules at its Pentre facility in Wales.
Company overview
RAM Innovations develops embedded-die packaging and provides research, development and manufacturing services for semiconductor and electronics producers. Its primary facility is in Pentre, Flintshire. The company embeds semiconductor devices within a core substrate, with interconnections and dielectric layers built around the devices. Its published examples include embedded ASICs and gallium nitride power devices. Services extend from proof-of-concept samples and process development to low-volume manufacture and production integration. Conventional assembly capabilities include wire bonding, flip-chip assembly, conductive adhesive attachment and sintering. The company also describes half-bridge building blocks for gallium nitride and silicon carbide applications, alongside integrated cooling approaches for power modules. Its history records work on sensor packaging and delivery of embedded power modules for aerospace applications.
Semiconductor activity
Primary capability: Advanced Packaging.
Technologies and capabilities
- Embedded die packaging
- Flip-chip assembly
- Wire bonding
- Sintering
- Integrated cooling
- Gallium nitride
- Silicon carbide
- Copper
- Aluminium nitride
Packaging process development; Embedded power modules; Proof-of-concept samples; Low-volume manufacturing; Production integration
Markets served
- Power electronics
- Aerospace
- Sensors
UK presence
Pentre.