Company profile
Custom Interconnect (CIL)
Hampshire electronics manufacturing company offering advanced semiconductor packaging, die attach, wire bonding and module assembly services.
Company overview
Custom Interconnect Limited (CIL) is an electronics manufacturing company based in Andover, Hampshire, providing outsourced semiconductor assembly and test (OSAT) services. The company states it operates the UK's largest semiconductor packaging production facilities. Its core semiconductor capabilities include wafer dicing, die bonding, wire bonding, flip-chip, and chip-on-board assembly. CIL produces packaging for a variety of devices, including RF MMICs, SiC and GaN power devices, multi-chip modules (MCM), and System-in-Package (SiP). Beyond its semiconductor focus, the company's services also cover surface-mount and conventional PCB assembly, box builds, product testing, and design services through a partner network. CIL serves multiple sectors, including aerospace, defence, automotive, medical, industrial, and communications. It operates from a head office and a dedicated semiconductor packaging site, both located in Andover.
Semiconductor activity
Primary capability: Advanced Packaging. Supply-chain role: OSAT, Assembly, Test, Manufacturing Services.
Technologies and capabilities
- Advanced Packaging
- Chiplets
- System In Package (SiP)
- Chip On Board (COB)
- Wire Bonding
- Die Bonding
- Flip Chip
- Silicon Carbide (SiC)
- Gallium Nitride (GaN)
Semiconductor Packaging; Wafer Dicing; PCB Assembly; Box Build; Device Testing; Design Services
Markets served
- Medical
- Defence
- Aerospace & Space
- Automotive
- Industrial
- Communications
UK presence
Andover. Other UK sites: Andover. Part of the Southampton / South East cluster.
Sources and verification
Last verified: 2026-09-29