Company profile
Engis UK
Supplies wafer grinding, lapping and polishing equipment and superabrasive consumables from Henley-on-Thames.
Company overview
The UK operation of Engis supplies superabrasive finishing products and equipment from its European head office in Henley-on-Thames. Semiconductor manufacturing is explicitly included among the industries served, alongside precision optics, aerospace and medical applications. Its product range combines diamond powders, lapping and polishing consumables, grinding wheels and related machinery. Wafer-processing equipment includes automated grinders in single-head and dual-head configurations, with semi-automatic and fully automatic options, together with a coolant filtration system. The wider Engis organisation develops and supports finishing processes through engineering and process development activities. Engis UK is one of the overseas subsidiaries of the US-based Engis Corporation.
Semiconductor activity
Primary capability: Semiconductor Manufacturing Equipment.
Technologies and capabilities
- Wafer grinding
- Lapping
- Polishing
- Superabrasive finishing
- Diamond
- Cubic boron nitride
Automated wafer grinders; Diamond powders; Grinding wheels; Polishing slurries; Coolant filtration
Markets served
- Semiconductors
- Precision optics
- Aerospace
- Medical
UK presence
Henley-on-Thames, South East. Part of the Thames Valley cluster.